Rockwell-automation System Design for the Control of Electrical Noise Bedienungsanleitung Seite 27

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Publication GMC-RM001A-EN-P July 2001
High Frequency (HF) Bonding 2-9
Grid and Raised Floor
Bonding cabinet panels and machine chassis to a ground grid below a
raised floor is the best possible grounding scheme and commonly
used in computer mainframe installations, but rarely used in industrial
environments.
Ideally the grid squares should be 1 m (39 in.) or less.
Figure 2.7
Panel ground plane extended to a grid beneath a raised floor
Grid ground plane.
Copper strip laid on the floor,
covered by a false floor
(also bonded to machine structure).
Cabinet ground plane (panel)
bonded to floor ground plane
Machine structure used as ground plane
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